74HC132DB(2012) Просмотр технического описания (PDF) - NXP Semiconductors.
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74HC132DB Datasheet PDF : 21 Pages
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NXP Semiconductors
16. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
74HC132; 74HCT132
Quad 2-input NAND Schmitt trigger
SOT27-1
D
L
Z
e
b
14
pin 1 index
A2 A
A1
wM
b1
8
ME
c
(e 1)
MH
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches
0.17
0.02
0.13
0.068 0.021 0.014
0.044 0.015 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT27-1
IEC
050G04
REFERENCES
JEDEC
JEITA
MO-001
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 15. Package outline SOT27-1 (DIP14)
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
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