BD235_07 Просмотр технического описания (PDF) - STMicroelectronics

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BD235_07

NPN power transistors

STMicroelectronics 

Package mechanical data

3 Package mechanical data

BD235 BD237

In order to meet environmental requirements, ST offers these devices in

ECOPACK® packages. These packages have a Lead-free second level

interconnect . The category of second level interconnect is marked on the

package and on the inner box label, in compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner

box label. ECOPACK is an ST trademark. ECOPACK specifications are available

at: www.st.com

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