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BSS138 Просмотр технического описания (PDF) - GUANGDONG HOTTECH INDUSTRIAL CO.,LTD.

Номер в каталоге
Компоненты Описание
производитель
BSS138
HOTTECH
GUANGDONG HOTTECH INDUSTRIAL CO.,LTD. HOTTECH
BSS138 Datasheet PDF : 4 Pages
1 2 3 4
Plastic-Encapsulate Mosfets
BSS138
Electrical Characteristics (TA=25°C, unless otherwise noted)
Symbol
Parameter
Test Conditions
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
BVDSS
TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
VGS = 0 V,
ID = 250 µA
ID = 250 µA,Referenced to 25°C
VDS = 50 V, VGS = 0 V
Min Typ Max Units
50
72
V
mV/°C
0.5
µA
IGSS
Gate–Body Leakage.
VDS = 30 V, VGS = 0 V
VGS = ±20 V, VDS = 0 V
100
nA
±100 nA
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
TJ
Gate Threshold Voltage
Temperature Coefficient
VDS = VGS,
ID = 1 mA
ID = 1 mA,Referenced to 25°C
0.8 1.3 1.6
V
–2
mV/°C
RDS(on)
Static Drain–Source
On–Resistance
VGS = 10 V,
VGS = 4.5 V,
ID = 0.22 A
ID = 0.22 A
3.5
6.0
ID(on)
On–State Drain Current
VGS = 10 V,
VDS = 5 V
0.2
A
gFS
Forward Transconductance
VDS = 10V,
ID = 0.22 A
0.12
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Gate Resistance
VDS = 25 V,
f = 1.0 MHz
V GS = 0 V,
VGS = 15 mV, f = 1.0 MHz
27
pF
13
pF
6
pF
9
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
VDD = 30 V,
VGS = 10 V,
ID = 0.29 A,
RGEN = 6
VDS = 25 V,
VGS = 10 V
ID = 0.22 A,
2.5 5
ns
9 18
ns
20 36
ns
7 14
ns
1.7 2.4
nC
0.1
nC
0.4
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
VGS = 0 V,
IS = 0.44 A(Note 2)
Voltage
0.22
A
0.8 1.4
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 350°C/W when mounted on a
minimum pad..
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%
GUANGDONG HOTTECH INDUSTRIAL CO,. LTD.
Page:P4 -P2

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