TDA1519C/N3C,112 Просмотр технического описания (PDF) - NXP Semiconductors.

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TDA1519C/N3C,112

22 W BTL or 2 x 11 W stereo power amplifier

NXP Semiconductors. 

NXP Semiconductors

22 W BTL or 2  11 W

stereo power amplifier

Product specification

TDA1519C

8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

10. Hot bar or manual soldering is suitable for PMFP packages.

11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar

soldering process. The appropriate soldering profile can be provided on request.

2004 Jan 28

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