TDA1519CTD/N3,118 Просмотр технического описания (PDF) - NXP Semiconductors.
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TDA1519CTD/N3,118 Datasheet PDF : 22 Pages
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NXP Semiconductors
22 W BTL or 2 11 W
stereo power amplifier
PACKAGE OUTLINES
SIL9P: plastic single in-line power package; 9 leads
D
non-concave
x
Eh
Product specification
TDA1519C
SOT131-2
Dh
view B: mounting base side
d
A2
B
j
E
A1
b
L
1
Z
e
9
wM
bp
c
Q
0
DIMENSIONS (mm are the original dimensions)
UNIT
A1
max.
A2
b
max.
bp
c
D(1)
d
mm
2
4.6
1.1 0.75 0.48 24.0 20.0
4.4
0.60 0.38 23.6 19.6
5
scale
10 mm
Dh
E (1)
e
Eh
10 12.2 2.54
6
11.8
j
L
Q
w
x
Z (1)
3.4
3.1
17.2
16.5
2.1
1.8
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT131-2
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-17
03-03-12
2004 Jan 28
13
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