BF720T1 Просмотр технического описания (PDF) - ON Semiconductor

Номер в каталоге

Компоненты Описание

производитель

BF720T1

NPN SILICON TRANSISTOR SURFACE MOUNT

ON Semiconductor 

BF720T1

200°C

150°C

100°C

STEP 1

PREHEAT

ZONE 1

RAMP"

STEP 2

VENT

SOAK"

STEP 3

HEATING

ZONES 2 & 5

RAMP"

STEP 4

STEP 5

HEATING HEATING

ZONES 3 & 6 ZONES 4 & 7

SOAK"

SPIKE"

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

160°C

170°C

150°C

STEP 6 STEP 7

VENT COOLING

205° TO 219°C

PEAK AT

SOLDER JOINT

100°C

140°C

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

50°C

TIME (3 TO 7 MINUTES TOTAL)

TMAX

Figure 6. Typical Solder Heating Profile

http://onsemi.com

6

Share Link: