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XC6501A451ML Просмотр технического описания (PDF) - TOREX SEMICONDUCTOR

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XC6501A451ML Datasheet PDF : 21 Pages
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XC6501 Series
PACKAGING INFORMATION (Continued)
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125)
Ambient Temperature(℃)
Power Dissipation PdmW
25
600
85
240
Evaluation Board(Unit:mm) 位:mm)
Thermal Resistance (/W)
166.67
700
600
500
400
300
200
100
0
25
Pd-TPadvs. Taグラフ
45
65
85
105
125
Ambient TemperatTuraeTa ()
20/21

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