CXA2570 Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXA2570

RF Matrix Amplifier

Sony Semiconductor 

Package Outline

Unit: mm

24PIN SSOP(PLASTIC)

∗7.8 ± 0.1

24

13

A

CXA2570N

+ 0.2

1.25 – 0.1

0.1

1

+ 0.1

0.22 – 0.05

0.13 M

12

0.65

+ 0.05

0.15 – 0.02

0.1 ± 0.1

NOTE: Dimensions “∗” does not include mold protrusion.

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-24P-L01

SSOP024-P-0056

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

PACKAGE MASS

0.1g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

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