B3S Просмотр технического описания (PDF) - OMRON Corporation
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B3S Datasheet PDF : 5 Pages
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B3S
Dimensions
Note: All units are in millimeters unless otherwise indicated.
Without Ground Terminal
B3S-1000
B3S-1002
3.3
dia.
B3S
PCB Mounting
(Top View)
Terminal Arrangement
/Internal Connections
(Top View)
With Ground Terminal
B3S-1100
B3S-1102
3.3
dia.
PCB Mounting
(Top View)
Terminal Arrangement
/Internal Connections
(Top View)
Precautions
Reflow Soldering
Attach a thermocouple to one side of the terminal with high-temper-
ature solder and use the thermocouple to set the reflow oven to a
peak terminal temperature of 230°±5°C. The optimum heating
curve is shown below.
10 s max.
1 to 4°C/s
1 to 5°C/s
Normal
temperature
60 to 90 s
20 s 30 s
max.
Time (s)
Note: The above heating curve applies if the
thickness of the circuit board is 1.6 mm.
Do not apply additional force to the plunger once it has stopped
moving.
Do not repeatedly press the plunger off-center or from an acute
angle.
B3S Switches are designed to allow submersed washing after sol-
dering. When washing, follow the guidelines given below:
1. Clean with alcohol solvents. Do not use chlorine solvents or
water.
2. When using ultrasonic cleaning in two- or three-tank systems
and do not clean for more than one minute at a time or for
more than three minutes total.
3. Do not apply external force to the Switch while washing.
4. Do not wash immediately after soldering. If possible, allow
components to stand for at least three minutes before
washing.
5. The Switch cannot be used where subject to direct contact
with water.
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