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553MLF Просмотр технического описания (PDF) - Integrated Device Technology

Номер в каталоге
Компоненты Описание
производитель
553MLF
IDT
Integrated Device Technology IDT
553MLF Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
ICS553
LOW SKEW 1 TO 4 CLOCK BUFFER
FAN OUT BUFFER
Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Inches*
8
INDEX
AREA
12
D
EH
Symbol
A
A1
B
C
D
E
e
H
h
L
α
Min
Max
1.35 1.75
0.10 0.25
0.33 0.51
0.19 0.25
4.80 5.00
3.80 4.00
1.27 BASIC
5.80 6.20
0.25 0.50
0.40 1.27
0°
8°
Min
Max
.0532 .0688
.0040 .0098
.013 .020
.0075 .0098
.1890 .1968
.1497 .1574
0.050 BASIC
.2284 .2440
.010 .020
.016 .050
0°
8°
*For reference only. Controlling dimensions in mm.
A
h x 45
A1
-C-
e
B
Ordering Information
Part / Order Number
Marking
553MLF
553MLF
553MLFT
553MLF
553MILF
553MILF
553MILFT
553MILF
SEATING
PLANE
C .10 (.004)
Shipping Packaging
Tubes
Tape and Reel
Tubes
Tape and Reel
L
Package
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
C
Temperature
0 to +70° C
0 to +70° C
-40 to +85 ° C
-40 to +85 ° C
"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT)
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any
circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or
critical medical instruments.
IDT® LOW SKEW 1 TO 4 CLOCK BUFFER
7
ICS553
REV N 051310

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