DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

LA4425A Просмотр технического описания (PDF) - ON Semiconductor

Номер в каталоге
Компоненты Описание
производитель
LA4425A Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
LA4425A
Load Resistance and Misoperation
It should be noted that when RL < 2Ω and VCC is high, and the switch is turned “ON” when setting is for a signal
(THD = 10%), the ground detector (current × voltage Schmitt circuit) operates momentarily.
Precautions on TaB
If power voltage is applied to the IC substrate (the heat sink on a set), the IC structure is such that the PN junctions
may be burned, causing deterioration or destruction. Consult Our company’s Quality Assurance Department with
regard to the energy handling capability (voltage peak value, pulse width). Also, the IC TaB (substrate) is connected
to pin 3, large signal GND.
Test of +VCC to Output Pin
Floating
+
+
b
LA4425A
+
a
13.2V
The power pin is in a floating state when a power capacitor is connected, so if +VCC touches output lines a and b , the
upper power transistor inside the IC will be damaged.
The LA4425A has a protective bypass route inside the IC.
Starting Time (ts)
This is set at 0.35sec/typ, but it can be made shorter by making input capacitor Ci smaller, or longer by making it
larger.
Pop noise
The pop noise prevention circuit operates to reduce pop until Rg reaches 50kΩ. However, if Rg is left open, the
charging route of input capacitor Ci is lost, so the pop noise reduction circuit stops operating and click noises become
louder.
VG/OSC
The voltage gain is fixed at 45dB inside the IC. It is impossible to change it externally.
Phase compensation capacitors (350pF/total) are connected between individual stages inside the IC, and the open
loop gain is low. In addition, the upper and lower drives are made equivalent so that final stage current gain is
adjusted, providing a measure against unwanted high-frequency parasitic oscillation peculiar to power IC’s.
BTL Connection
Connection is impossible with IC alone.
Reverse Mounting of IC
The pin assignment is such that there is no danger of damage.
T.S.D (Thermal Shutdown) Operating Temperature
30×30×1.5mm3 thick Al board
Ta=25°C
0 20 40 60 80 100 120 140 160 180
Tc (°C)
No.A0195-8/9

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]