Philips Semiconductors
12. Package outline
SO8: plastic small outline package; 8 leads; body width 7.5 mm
TEA1501
GreenChip SMPS controller IC
SOT176-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
1
e
4
bp
wM
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D(1) E(1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
7.65
7.45
7.6
7.4
1.27
10.65
10.00
1.45
1.1
0.45
1.1
1.0
0.25 0.25
0.1
2.0
1.8
8o
inches
0.1
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.30
0.29
0.30
0.29
0.05
0.419
0.394
0.057
0.043
0.018
0.043
0.039
0.01
0.01 0.004 0.079
0.071
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT176-1
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
03-02-19
Fig 9. Package outline SOT176-1 (SO8)
TEA1501_2
Product data sheet
Rev. 02 — 31 March 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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