238164063681 Просмотр технического описания (PDF) - Vishay Semiconductors
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Компоненты Описание
производитель
238164063681 Datasheet PDF : 17 Pages
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www.vishay.com
PACKAGING
TAPE SPECIFICATIONS
Thermistors on tape
P
D
H3
d
D0
L
NTCLE100E3
Vishay BCcomponents
T
P
H
H2
H1
H
W0
A
W1
W
1E pitch
NTCLE100E3...T1
P0
P1 F
Direction of unreeling
detail A
W2
t
Taped according to IEC 60286-2
(cover tape may differ from shown)
DIMENSIONS in millimeters
DETAILS
Body diameter
Lead diameter
Feed hole diameter
Lead to lead distance
SYMBOL DIMENSIONS NOMINAL TOLERANCE
D
3.3
± 0.5
d
0.6
± 0.06
D0
4.0
± 0.2
F
2.5
+0.5
-0.2
Distance component to tape centre
H
22.0
Component height
Component alignment
H1
32.2
h
0
Distance top/bottom of components
H2
6
Length of lacquer under the comp. bottom H3
2
± 1.0
max.
± 2.0
max.
±1
Length of snipped lead
L
11.0
max.
Pitch between thermistors
P
12.7
Feed hole pitch
P0
12.7
Feed hole center to lead center
P1
5.08
Component alignment
p
0
Total thickness
Total tape thickness
T
3.0
t
0.9
± 1.0
± 0.3
± 0.7
± 1.3
max.
max.
Tape width
Hold down tape width
Hole position
Hold down tape position
W
18.0
W0
5.0
W1
9.0
W2
1.5
± 1.0
- 0.5
± 0.3
± 0.5
± 1.0
REMARKS
5 max. for 3.3 to 220
Guaranteed between
component and tape
1 to 4 max. for 3.3 to 220
Cumulative pitch error
± 1 mm/20 pitches
guaranteed between
component and tape
4 max. for 3.3 to 220 with
cardboard tape 0.5 ± 0.1
None of the hold down tapes may
cover the holes
Revision: 22-Dec-16
14
Document Number: 29049
For technical questions, contact: nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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