NE34018-T1 Просмотр технического описания (PDF) - NEC => Renesas Technology

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производитель

NE34018-T1

L to S BAND LOW NOISE AMPLIFIER N-CHANNEL HJ-FET

NEC => Renesas Technology 

NE34018

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

<TYPES OF SURFACE MOUNT DEVICE>

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Soldering process

VPS

Wave soldering

Infrared ray reflow

Partial heating method

Soldering conditions

Package peak temperature: 215 qC,

Time: 40 seconds MAX. (200 qC MIN.),

Number of times: 3, Number of days: not limited*

Soldering bath temperature: 260 qC MAX.,

Time: 10 seconds MAX., Number of times: 1,

Number of days: not limited*

Peak package’s surface temperature: 230 qC below,

Reflow time: 30 seconds or below (210 qC or higher),

Number of reflow process: 3, Exposure limit*: None

Terminal temperature: 230 qC or below,

Flow time: 10 seconds or below, Exposure limit*: None

Symbol

VP15-00-3

WS60-00-1

IR30-00-3

* Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25 qC and relative humidity at 65 % or less.

Note Do not apply more than a single process at once, except for “Partial heating method”.

PRECAUTION Avoid high static voltage and electric fields, because this device is Hetero Junction

field effect transistor with shottky barrier gate.

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