F461BC823K400L Просмотр технического описания (PDF) - Unspecified

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F461BC823K400L

Single Metallized Polypropylene Film

Unspecified 

Film Capacitors

General Purpose, Pulse and DC Transient Suppression – F461 – 464 Series Single Metallized Polypropylene Film

Soldering Process

The implementation of the RoHS Directive has required the selection

SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has

increased the liquidus temperature from that of 183ºC for SnPb

eutectic alloy to 217ºC – 221ºC for the new alloys. As a result, the

heat stress to components, even in wave soldering, has increased

considerably due to higher pre-heat and wave temperatures.

Polypropylene capacitors are especially sensitive to heat (melting

point of polypropylene is 160ºC – 170ºC). Wave soldering can

be destructive especially for mechanically small polypropylene

capacitors and great care must be taken during soldering. The solder

profiles from KEMET are highly recommended. You may also refer

to the wave soldering curve from IEC Publication 61760–1 Edition 2.

Please consult KEMET with any questions.

Construction

1 Section

Metal Contact

Layer

Molded Plastic

Case

Single-sided Metallized

Polypropylene Film

(First Layer)

Single-sided Metallized

Polypropylene Film

(Second Layer)

Margin

Margin

Metal Contact

Layer

Margin

Leads

Detailed Cross Section

Molded Plastic Self-Extinguishing

Case

Resin

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

F3028_F461-464 • 10/7/2014 24

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