DB2-030P(701) Просмотр технического описания (PDF) - Amphenol Aerospace

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Компоненты Описание

производитель

DB2-030P(701)

Amphenol® Low Mating Force Rectangular Connectors

Amphenol Aerospace 

Low Mating Force Rectangular Connectors

how to order (commercial types)

MB, DB, I/O, PC Connectors

Proprietary Part Number Ordering Procedure

Example part number MB2-120P- (  ) is shown as follows:

MB

2-

120 P - (  )

Body Type

Number of Rows

Total Number of Contacts

Termination Style

Variation Suffix

Body Type

MB designates Mother Board

DB designates Daughter Board

I/O designates Input/Output

PC designates Printed Circuit

Number of Rows

2, 3 or 4 rows

Total Number of Contacts

See Contact Arrangements, pages 8 and 9

Standard Termination Style

(Stickout values below apply to “J” dimension referenced on

individual connector catalog pages).

MBX-XXXP

MBX-XXXW

DBX-XXXP

IOX-XXXC

IOX-XXXP

PCX-XXXP

Straight PCB stud,  .021 dia,  .113 ±.025

stick­out, Sn/Ni plate

Solderless wrap,  .025 sq.,  .507 ±.025

stickout, Sn/Ni plate

90° PCB stud,  .021 dia,  .085 ±.025 stickout,

Sn/Ni plate

Crimp, rear removable contact, size 22D wire

well, Sn/Ni plate

PCB stud,  .021 dia,  .145 ±.025 stickout,

Sn/Ni plate

90° PCB stud,  .021 dia., .095

+.035

–.025

stickout

Sn/Ni plate

LEGEND:

Sn/Ni designates Tin over Nickel

Au/Ni designates Gold over Nickel

Au/Cu designates Gold over Copper

Amphenol

RoHS

U / 2002 / 95 / E

SnPb/Cu designates Tin-Lead over Copper

Variation Suffix

(Stickout values below apply to “J” dimension referenced

on   individual connector catalog pages.)

(700)

(701)

(702)

(703)

(704)

(705)

(706)

(707)

(709)

(710)

(711)

(713)

(714)

(715)

(716)

(717)

(718)

(719)

(720)

(721)

(722)

(723)

(724)

(725)

(726)

(727)

(728)

(729)

(730)

(731)

Gold plate in accordance with MIL-G-45204, type

II,  .000030 min. thick gold (.000050 for solderless wrap)

over  .000050 min. thick nickel (standard

termination length)

Gold plate in accordance with MIL-G-45204, type

II,  .000050 min. thick gold over  .00015 min. thick

copper (standard termination length)

PCB stud stickout of  .145, Sn/Ni plate, MB-P

Au/Ni [same as (700)], PCB stud stickout of  .145, MB-P

Au/Cu [same as (701)], PCB stud stickout of  .145, MB-P

90° PCB stud,  .120 stickout. Sn/Ni plate, DB

Au/Ni [same as (700)], 90° PCB stud  .120 stickout, DB

Au/Cu [same as (701)], 90° PCB  .120 stickout, DB

PCB stud stickout of  .300 DB (90°),  .300 MB-P &

.335 IO-P, Sn/Ni plate

Solderless wrap,  .025 sq.,  .665 stickout, Sn/Ni plate,

MB-W

Solderless wrap,  .025 sq.,  .665 stickout, Au/Ni,

[same as (700)], MB-W

PCB stud stickout of  .060, Sn/Ni plate, IO-P

90° PCB stud stickout of  .150, Sn/Ni plate, PC & DB

Solderless wrap,  .025 sq.,  .665 stickout, Au/Cu

[same as (701)], MB-W

90° PCB stud stickout of  .085 matte tin, DB

90° PCB stud stickout of  .095 matte tin, PC

90° PCB stud stickout of  .120 matte tin, DB

PCB stud stickout of  .300 MB-P &  .335 IO-P, matte tin

PCB stud stickout of  .060 matte tin, IO-P

PCB stud stickout of  .500, Sn/Ni plate, IO-P

PCB stud stickout of  .356 matte tin, MB-P

PCB stud stickout of  .192, Sn/Ni plate, MB-P

90° PCB stud stickout of  .095, RTV potted rear,

Sn/Ni plate, PC

90° PCB stud stickout of  .120, RTV potted rear,

Sn/Ni plate, DB

90° PCB stud stickout of  .150, RTV potted rear,

Sn/Ni plate, PC & DB

PCB stud stickout of  .145, RTV potted rear,

Sn/Ni plate, MB-P

PCB stud stickout of  .145, Au/Ni, [same as (700)],

RTV potted rear, MB-P

90° PCB stud stickout of  .120, Au/Ni, [same as (700)],

RTV potted rear, DB

90° PCB stud stickout of  .150, Au/Ni, [same as (700)

above], PC and DB

PCB stud stickout of  .145, matte tin, MB-P

Variation Suffixes continued on next page.

4

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