MF0ICU1001W(2010) Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

производитель

MF0ICU1001W
(Rev.:2010)

MIFARE Ultralight contactless single-ticket IC

NXP Semiconductors. 

NXP Semiconductors

MF0ICU1

MIFARE Ultralight contactless single-ticket IC

7. Chip orientation and bondpad locations

x (μm) y (μm)

Bump size

LA, LB, VSS

TESTIO

Chip Step

90

60

645(1)

90

60

665(1)

typ. 20.0 (1)

min. 5.0

241.7

125.5

typ. 20.0 (1)

min. 5.0

231.0

215.0

TESTIO

LA

VSS

LB

256.7

typ. 665.0 (1)

189.9

246.0

231.0

typ. 645.0 (1)

(1) The air gap between dies may vary due to foil expansion.

All dimensions in μm.

Pad locations measured from die center.

Fig 4. Chip orientation and bondpad locations

001aal531

MF0ICU1

Product data sheet

PUBLIC

All information provided in this document is subject to legal disclaimers.

Rev. 3.8 — 22 December 2010

028638

© NXP B.V. 2010. All rights reserved.

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