DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

MF0ICU1001W(2010) Просмотр технического описания (PDF) - NXP Semiconductors.

Номер в каталоге
Компоненты Описание
производитель
MF0ICU1001W
(Rev.:2010)
NXP
NXP Semiconductors. NXP
MF0ICU1001W Datasheet PDF : 28 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
MF0ICU1
MIFARE Ultralight contactless single-ticket IC
2. Features and benefits
2.1 MIFARE RF interface ISO/IEC 14443 A
„ Contactless transmission of data and supply energy (no battery needed)
„ Operating distance up to 100 mm depending on antenna geometry
„ Operating frequency of 13.56 MHz
„ Data transfer of 106 kBs
„ Data integrity of 16-bit CRC, parity, bit coding, bit counting
„ Anticollision
„ 7-byte serial number in accordance with ISO/IEC 14443-3 cascade level 2
„ Typical ticketing transaction time of < 35 ms
„ Fast counter transaction time of < 10 ms
2.2 EEPROM
„ 512-bit, organized in 16 pages with 4 bytes per page
„ Field programmable read-only locking function per page
„ 32-bit user definable One-Time Programmable (OTP) area
„ 384-bit user Read/Write area (12 pages)
„ Data retention time of 5 years
„ Write endurance 10000 cycles
3. Ordering information
Table 1. Ordering information
Type number
Package
Commercial
Name
MF0ICU1001W/S7DL FFC
Name
-
MF0ICU1101W/S7DL FFC
-
MF0ICU1001W/U7DL FFC
-
MF0ICU1101W/U7DL FFC
-
MF0MOA4U10/D
MOA4
PLLMC
Description
Version
8 inch wafer (sawn; 75 µm thickness, on film -
frame carrier; electronic fail die marking
according to SECSII format) see Section 7 and
Section 8, 17 pF input capacitance
8 inch wafer (sawn; 75 µm thickness, on film -
frame carrier; electronic fail die marking
according to SECSII format) see Section 7 and
Section 8, 50 pF input capacitance
8 inch wafer (sawn; 120 µm thickness, on film -
frame carrier; electronic fail die marking
according to SECSII format) see Section 7 and
Section 8, 17 pF input capacitance
8 inch wafer (sawn; 120 µm thickness, on film -
frame carrier; electronic fail die marking
according to SECSII format) see Section 7 and
Section 8, 50 pF input capacitance
plastic leadless module carrier package; 35 mm SOT500-2
SOT500-2 wide tape, 17 pF input capacitance
MF0ICU1
Product data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.8 — 22 December 2010
028638
© NXP B.V. 2010. All rights reserved.
3 of 28

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]