ITG3200 Просмотр технического описания (PDF) - Unspecified

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ITG3200

The ITG-3200 triple-axis MEMS gyroscope

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ITG-3200 Product Specification

Document Number: PS-ITG-3200A-00-01.4

Revision: 1.4

Release Date: 03/30/2010

9.10 MEMS Handling Instructions

MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of millions of

consumer, automotive and industrial products. MEMS devices consist of microscopic moving mechanical structures.

They differ from conventional IC products even though they can be found in similar packages. Therefore, MEMS

devices require different handling precautions than conventional ICs prior to mounting onto printed circuit boards

(PCBs).

The ITG-3200 gyroscope has a shock tolerance of 10,000g. InvenSense packages its gyroscopes as it deems proper for

protection against normal handling and shipping. It recommends the following handling precautions to prevent potential

damage.

Individually packaged or trays of gyroscopes should not be dropped onto hard surfaces. Components placed in trays

could be subject to g-forces in excess of 10,000g if dropped.

Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually snapping apart.

This could also create g-forces in excess of 10,000g.

9.11 Gyroscope Surface Mount Guidelines

Any material used in the surface mount assembly process of the MEMS gyroscope should be free of restricted RoHS

elements or compounds. Pb-free solders should be used for assembly.

In order to assure gyroscope performance, several industry standard guidelines need to be considered for surface

mounting. These guidelines are for both printed circuit board (PCB) design and surface mount assembly and are

available from packaging and assembly houses.

When using MEMS gyroscope components in plastic packages, package stress due to PCB mounting and assembly

could affect the output offset and its value over a wide range of temperatures. This is caused by the mismatch between

the Coefficient Temperature Expansion (CTE) of the package material and the PCB. Care must be taken to avoid

package stress due to mounting.

9.12 Reflow Specification

The approved solder reflow curve shown in the figure below conforms to IPC/JEDEC J-STD-020D.01

(Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) with a maximum peak

temperature (Tc = 260°C). This is specified for component-supplier reliability qualification testing using lead-free

solder for package thicknesses less than 1.6 mm. The reliability qualification pre-conditioning used by InvenSense

incorporates three of these conforming reflow cycles. All temperatures refer to the topside of the QFN package, as

measured on the package body surface. Customer solder-reflow processes should use the solder manufacturer’s

recommendations, making sure to never exceed the constraints listed in the table and figure below, as these represent

the maximum tolerable ratings for the device. For optimum results, production solder reflow processes should use

lower temperatures, reduced exposure times to high temperatures, and lower ramp-up and ramp-down rates than those

listed below.

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