L5150GJ Просмотр технического описания (PDF) - STMicroelectronics

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L5150GJ

5 V low dropout voltage regulator

STMicroelectronics 

Package and PCB thermal data

4

Package and PCB thermal data

4.1

PowerSSO-12 thermal data

Figure 29. PowerSSO-12 PC board

L5150GJ

.

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1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias,

FR4 area = 77 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness = 70 µm (front and back side) thermal

vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm,

footprint dimension 4.1 mm x 6.5 mm ).

Figure 30. Rthj-amb vs PCB copper area in open box free air condition

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*$3*36

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Doc ID 15540 Rev. 12

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