L6402MH10RI Просмотр технического описания (PDF) - Advanced Micro Devices
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производитель
L6402MH10RI
Advanced Micro Devices
L6402MH10RI Datasheet PDF : 57 Pages
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CONNECTION DIAGRAMS
80-ball Fortified BGA
Top View, Balls Facing Down
A8
DQ21
B8
DQ28
A7
B7
DQ23/A-1 A13
C8
RFU
C7
A12
D8
RFU
D7
A14
A6
B6
DQ30 A9
C6
D6
A8
A10
A5
B5
C5
D5
VSS WE# RESET# A21
A4
B4
C4
D4
VCC RY/BY# WP#/ACC A18
A3
B3
C3
D3
DQ31/A-1 A7
A17
A6
A2
B2
C2
D2
DQ18 A3
A4
A2
A1
B1
C1
D1
RFU DQ16 VCC
RFU
E8
VIO
E7
A15
E6
A11
E5
A19
E4
A20
E3
A5
E2
A1
E1
RFU
F8
G8
H8
J8
K8
VSS
RFU RFU DQ29 DQ22
F7
G7
H7
J7
K7
A16 WORD# DQ15
VSS
DQ20
F6
DQ7
G6
DQ14
H6
DQ13
J6
DQ6
K6
DQ27
F5
DQ5
F4
DQ2
G5
DQ12
G4
DQ10
H5
VCC
H4
DQ11
J5
DQ4
J4
DQ3
K5
DQ26
K4
DQ19
F3
DQ0
G3
DQ8
H3
DQ9
J3
DQ1
K3
DQ17
F2
G2
H2
J2
K2
A0
CE#
OE#
VSS
VCC
F1
G1
H1
J1
K1
RFU
VIO
RFU DQ24 DQ25
Note: The FBGA package pinout configuration shown is preliminary. The ball count and package physical dimensions have not
yet been determined. Contact AMD for further information.
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP, BGA, PLCC, PDIP,
SSOP). The package and/or data integrity may be
compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of
time.
6
Am29LV6402M
January 23, 2006
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