LSGT670-JLJL-1-Z Просмотр технического описания (PDF) - Unspecified

Номер в каталоге

Компоненты Описание

производитель

LSGT670-JLJL-1-Z

Multi TOPLED®

Unspecified 

LSG T670, LSP T670, LOP T670, LYG T670

Lötbedingungen

Soldering Conditions

Reflow Lötprofil für bleifreies Löten

Reflow Soldering Profile for lead free soldering

300

˚C

T 250

200

240 ˚C

217 ˚C

150

tS

100

Vorbehandlung nach JEDEC Level 2

Preconditioning acc. to JEDEC Level 2

(nach J-STD-020D.01)

(acc. to J-STD-020D.01)

OHA04525

Tp 245 ˚C

tP

tL

50

25 ˚C

0

0

50

100

150

200

250

s 300

t

Profil-Charakteristik

Profile Feature

Ramp-up Rate to Preheat*)

25 °C to 150 °C

Symbol

Symbol

Pb-Free (SnAgCu) Assembly

Minimum Recommendation Maximum

2

3

Time tS

TSmin to TSmax

tS

60

Ramp-up Rate to Peak*)

TSmax to TP

Liquidus Temperature

TL

Time above Liquidus temperature

tL

100

120

2

3

217

80

100

Peak Temperature

TP

245

260

Time within 5 °C of the specified peak tP

10

20

30

temperature TP - 5 K

Ramp-down Rate*

TP to 100 °C

Time

25 °C to TP

3

6

480

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

OHA04612

Einheit

Unit

K/s

s

K/s

°C

s

°C

s

K/s

s

2012-04-20

11

Share Link: