Package Dimensions
unit : mm
SPQFP100 14x14 / SQFP100
CASE 131AC
ISSUE A
16.00.2
14.00.1
LC75878W
(1.0)
12
0.5
0.2
0.10
0.145
0.10
SOLDERING FOOTPRINT*
15.40
(Unit: mm)
0 to 10
GENERIC
MARKING DIAGRAM*
XXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
0.50
0.28
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
35