HT6P20F2T3 Просмотр технического описания (PDF) - Holtek Semiconductor
Номер в каталоге
Компоненты Описание
производитель
HT6P20F2T3 Datasheet PDF : 12 Pages
| |||
HT6P20B2T3/D2T3/F2T3
224 Encoder with ASK Transmitter
Pin Description
Pin Name
NC
D0~D1
D2~D3
D4
EN
VDD
AVDD
VSS
AVSS
PAOUT
XIN
XOUT
DOUT
I/O
Internal
Connection
Description
¾
¾
No connection for HT6P20B2T3/HT6P20D2T3
I
CMOS in Pull-high
Data input and transmission enable - active low. Can be externally set
to VSS or left open.
I
CMOS in Pull-high
Data input and transmission enable - active low. Can be externally set
to VSS or left open for the HT6P20D2T3.
I
CMOS in Pull-high
Data input and transmission enable - active low. Can be externally set
to VSS or left open for the HT6P20F2T3.
I
RF enable pin
RF enable - active high; When set low, the RF is enabled by the data
input.
¾
¾
Positive power supply
¾
¾
RF positive power supply
¾
¾
Negative power supply, ground
¾
¾
RF negative power supply, ground
O Power amplify output L/C matching circuit
O Crystal Fs input
Crystal value is 9.84375MHz at 315MHz and 13.56MHz at 433.92MHz
I Crystal Fs output
O CMOS OUT
Data serial transmission output
Approximate Internal Connection Circuits
D 0 ~ D 5 P in s
D O U T P in
V DD
V DD
V SS
V SS
Absolute Maximum Ratings
Supply Voltage ..............................................................................................VSS-0.3V to VSS+3.6V
Storage Temperature .................................................................................................-50°C to 125°C
Input Voltage .................................................................................................VSS-0.3V to VDD+0.3V
Operating Temperature................................................................................................-40°C to 85°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Rat-
ings² may cause substantial damage to the device. Functional operation of this device at other condi-
tions beyond those listed in the specification is not implied and prolonged exposure to extreme
conditions may affect device reliability.
Rev. 1.00
3
September 13, 2010
Share Link: 