AH2 Просмотр технического описания (PDF) - WJ Communications => Triquint
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AH2 Datasheet PDF : 5 Pages
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AH2
High Dynamic Range Amplifier
The Communications Edge TM
Product Information
AH2-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded
(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AH2-G will be marked with an “AH2G”
designator. An alphanumeric lot code
(“XXXX-X” ) is also marked below the part
designator on the top surface of the package.
The obsolete tin-lead package is marked with
an “AH2” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1B
Value:
Passes 500V to <1000V
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Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes 1000V to <2000V
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Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 C convection reflow
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Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
Thermal Specifications
1000
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
-40 to +85 qC
59 qC / W
100
Junction Temperature, Tj (2)
129 qC
MTTF vs. GND Tab Temperature
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
10
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85 C case temperature. A
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minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 C.
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1
60 70 80 90 100 110
Tab Temperature (°C)
Specifications and information are subject to change without notice.
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
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Page 5 of 5 April 2006
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