MMDF3N02HD Просмотр технического описания (PDF) - ON Semiconductor
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MMDF3N02HD Datasheet PDF : 8 Pages
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MMDF3N02HD
Preferred Device
Power MOSFET
3 Amps, 20 Volts
N−Channel SO−8, Dual
These miniature surface mount MOSFETs feature ultra low RDS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain−to−source diode has a very low reverse recovery time.
MiniMOSt devices are designed for use in low voltage, high speed
switching applications where power efficiency is important. Typical
applications are dc−dc converters, and power management in portable
and battery powered products such as computers, printers, cellular and
cordless phones. They can also be used for low voltage motor controls
in mass storage products such as disk drives and tape drives. The
avalanche energy is specified to eliminate the guesswork in designs
where inductive loads are switched and offer additional safety margin
against unexpected voltage transients.
Features
• Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, With Soft Recovery
• IDSS Specified at Elevated Temperature
• Avalanche Energy Specified
• Mounting Information for SO−8 Package Provided
• Pb−Free Package is Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 1.0 MW)
Gate−to−Source Voltage − Continuous
Drain Current − Continuous @ TA = 25°C
Drain Current − Continuous @ TA = 100°C
Drain Current − Single Pulse (tp ≤ 10 ms)
Total Power Dissipation @ TA = 25°C (Note 1)
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C (VDD = 20 Vdc,
VGS = 5.0 Vdc, Peak IL = 9.0 Apk,
L = 10 mH, RG = 25 W)
Thermal Resistance, Junction−to−Ambient
(Note 1)
VDSS
VDGR
VGS
ID
ID
IDM
PD
TJ, Tstg
EAS
RqJA
20
Vdc
20
Vdc
± 20
Vdc
3.8
Adc
2.6
19
Apk
2.0
W
− 55 to 150 °C
405
mJ
62.5 °C/W
Maximum Lead Temperature for Soldering
TL
260
°C
Purposes, 1/8″ from case for 10 seconds
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Mounted on 2″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided) with
one die operating, 10 sec. max.
© Semiconductor Components Industries, LLC, 2006
1
February, 2006 − Rev. 7
http://onsemi.com
3 AMPERES, 20 VOLTS
RDS(on) = 90 mW
N−Channel
D
G
8
1
S
SO−8, DUAL
CASE 751
STYLE 11
MARKING
DIAGRAM
8
D3N02
AYWWG
G
1
D3N02
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Source−1
Gate−1
Source−2
Gate−2
1 8 Drain−1
2 7 Drain−1
3 6 Drain−2
4 5 Drain−2
ORDERING INFORMATION
Device
Package Shipping†
MMDF3N02HDR2 SO−8 2500 Tape & Reel
MMDF3N02HDR2G SO−8 2500 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MMDF3N02HD/D
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