ML14469QP Просмотр технического описания (PDF) - LANSDALE Semiconductor Inc.
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ML14469QP Datasheet PDF : 10 Pages
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ML14469
LANSDALE Semiconductor, Inc.
40
1
H
A
G
F
OUTLINE DIMENSIONS
P DIP 40 = QP
(ML14469QP)
PLASTIC DIP
CASE 711–03
21
B
20
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 51.69 52.45 2.035 2.065
B 13.72 14.22 0.540 0.560
C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
G
2.54 BSC
0.100 BSC
H 1.65 2.16 0.065 0.085
J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
L 15.24 BSC
0.600 BSC
M
0
15
0
15
N 0.51 1.02 0.020 0.040
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
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