CXB1595AN Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXB1595AN

Fibre Channel Repeater

Sony Semiconductor 

Package Outline

Unit: mm

30PIN SSOP (PLASTIC)

∗9.7 ± 0.1

30

16

A

+ 0.2

1.25 – 0.1

0.10

CXB1595AN

1

15

b

0.65

0.13 M

0.1 ± 0.1

+ 0.1

b=0.22 – 0.05

(0.22)

b=0.22 ± 0.03

DETAIL B : SOLDER

DETAIL B : PALLADIUM

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-30P-L01

SSOP030-P-0056

NOTE: Dimension “∗” does not include mold protrusion.

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

– 14 –

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