CAV24C02(2015) Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание

производитель

CAV24C02
(Rev.:2015)

2-Kb, 4-Kb, 8-Kb and 16-Kb I2C CMOS Serial EEPROM

ON Semiconductor 

CAV24C02, CAV24C04, CAV24C08, CAV24C16

PACKAGE DIMENSIONS

WLCSP4, 0.84x0.86

CASE 567DC

ISSUE D

E

PIN A1

ÈÈÈÈ REFERENCE

AB

D

2X

0.10 C

2X

0.10 C TOP VIEW

* Die Coat

(Optional)

A3*

DETAIL A

0.10 C

A2

A

DETAIL A

0.05 C

NOTE 4

A1

SIDE VIEW

C

SEATING

PLANE

NOTE 3

A2

A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DATUM C, THE SEATING PLANE, IS DEFINED BY

THE SPHERICAL CROWNS OF THE CONTACT

BALLS.

4. COPLANARITY APPLIES TO SPHERICAL CROWNS

OF THE CONTACT BALLS.

5. DIMENSION b IS MEASURED AT THE MAXIMUM

CONTACT BALL DIAMETER PARALLEL TO DATUM C.

MILLIMETERS

DIM MIN MAX

A 0.28 0.38

A1 0.08 0.12

A2

0.23 REF

A3* 0.025 REF

b 0.16 0.20

D

0.84 BSC

E

0.86 BSC

e

0.40 BSC

* Die Coat (Optional)

4X b

0.10 M C A B

B

NOTE 5

A

e

e

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BOTTOM VIEW

RECOMMENDED

SOLDERING FOOTPRINT*

A1

PACKAGE

OUTLINE

0.40

PITCH

4X

0.18

0.40

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

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