ADF4001BRU-REEL Просмотр технического описания (PDF) - Analog Devices
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ADF4001BRU-REEL Datasheet PDF : 17 Pages
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ADF4001
OUTLINE DIMENSIONS
5.10
5.00
4.90
ORDERING GUIDE
Model1
ADF4001BRU
ADF4001BRU-REEL
ADF4001BRU-REEL7
ADF4001BRUZ
ADF4001BRUZ-R7
ADF4001BRUZ-RL
ADF4001BCPZ
ADF4001BCPZ-RL
ADF4001BCPZ-RL7
EV-ADF4001SD1Z
1 Z = RoHS Compliant Part.
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 13. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.50
BSC
0.30
0.25
0.18
16
15
20
1
EXPOSED
PAD
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
11
5
0.65
0.60
10
6
BOTTOM VIEW
0.20 MIN
0.55
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1.
Figure 14. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Evaluation Board
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
CP-20-6
CP-20-6
CP-20-6
Rev. B | Page 16
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