ESMT
Functional Block Diagram
AD8256A
Available Package
Package Type
Device No. θja(℃/W) Ψjt(℃/W) θjc(℃/W) Exposed Thermal Pad
7x7 48L QFN
23.5
1.6
12.5
AD8256A
7x7 48L E-LQFP
23.8
1.8
15.8
Yes (Note3)
Note3:The thermal pad is at the bottom of package. To optimize the performance of thermal dissipation,
solder the thermal pad to PCB’s ground plane is suggested.
Elite Semiconductor Memory Technology Inc.
Publication Date: May. 2007
Revision: 1.3 4/33