ADA4691-2/ADA4691-4/ADA4692-2/ADA4692-4
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.30
0.23
0.18
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
1.75
1.60 SQ
1.45
0.50
0.40
9
8
4
5
BOTTOM VIEW
0.25 MIN
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
Figure 62. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
BALL A1
IDENTIFIER
1.250
1.210
1.170
TOP VIEW
(BALL SIDE DOWN)
0.415
0.400
0.385
1.260
1.220
1.180
0.645
0.600
0.555
SEATING
PLANE
0.287
0.267
0.247
0.40
BSC
0.230
0.200
0.170
0.05 NOM
COPLANARITY
3
2
1
A
B
C
BOTTOM VIEW
(BALL SIDE UP)
Figure 63. 9-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-9-3)
Dimensions shown in millimeters
Rev. D | Page 17 of 20