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UPC3211GR-E1 Просмотр технического описания (PDF) - NEC => Renesas Technology

Номер в каталоге
Компоненты Описание
производитель
UPC3211GR-E1
NEC
NEC => Renesas Technology NEC
UPC3211GR-E1 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
µPC3211GR
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Infrared Reflow
VPS
Partial Heating
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limitNote: None
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limitNote: None
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limitNote: None
Recommended Condition
Symbol
IR35-00-3
VP15-00-3
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of the recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P13564EJ3V0DS00
15

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