WS82C55A-5C Просмотр технического описания (PDF) - Wing Shing International Group
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WS82C55A-5C Datasheet PDF : 25 Pages
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(Unit : mm)
Mirror finish
Notes for Mounting the Surface Mount Type Package
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.41 TYP.
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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