Package and PCB thermal data
4
Package and PCB thermal data
4.1
PowerSO-10 thermal data
Figure 21. PowerSO-10 PC board(1)
VN610SP-E
1. LCauytohuict kcnoensdsiti=on35oµf mRt,hCaonpdpZerthamreeaass:ufrroemmemntinsim(PuCmBpFaRd4-laayr-eoau=t t5o88mcmm2x).58mm, PCB thickness = 2mm,
Figure 22. Rthj-amb vs PCB copper area in open box free air condition
RTHj_amb (°C/W)
55
50
Tj-Tamb=50°C
45
40
35
30
0
2
4
6
8
10
PCB Cu heatsink area (cm^2)
20/27
Doc ID 10889 Rev 5