HMMC-1002 Просмотр технического описания (PDF) - HP => Agilent Technologies
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HMMC-1002 Datasheet PDF : 8 Pages
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610
233
RF
IN
0
0
476 584
Notes:
1. All dimensions in microns and shown to center of bond pad.
2. DCin, V1, DCout, and V2 bonding pads are 75 x 75 microns.
3. RF input and output bonding pads are 60 x 70 microns.
4. Chip thickness: 127 ± 15 µm.
Figure 2. HMMC-1002 Bonding Pad Locations.
887 994
2.0 mil
nom. gap
RFIN
TC721A
RFOUT
4 Wire Bonds using
0.7 mil dia. Gold Bond Wire
(Length NOT important)
DCIN
V1
DCOUT
V2
Figure 3. HMMC-1002 Assembly Diagram.
RF
233
OUT
1410
1470
7-15
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