UPD3799 Просмотр технического описания (PDF) - NEC => Renesas Technology
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UPD3799 Datasheet PDF : 20 Pages
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µPD3799
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
to consult with our sales offices.
For more details, refer to our document "Semiconductor Device Mounting Technology Manual"(C10535E).
Type of Through-hole Device
µPD3799CY : CCD linear image sensor 32-pin plastic DIP (400 mil)
Process
Conditions
Partial heating method
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per pin)
Caution During assembly care should be taken to prevent solder or flux from contacting the plastic cap.
The optical characteristics could be degraded by such contact.
DATA SHEET S14083EJ1V0DS00
17
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