UPD16716 Просмотр технического описания (PDF) - NEC => Renesas Technology

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Компоненты Описание

производитель

UPD16716

384-OUTPUT TFT-LCD SOURCE DRIVER (COMPATIBLE WITH 64-GRAY SCALES)

NEC => Renesas Technology 

µ PD16716

10. RECOMMENDED SOLDERING CONDITIONS

The following conditions must be met for soldering conditions of the µ PD16716.

For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).

Please consult with our sales offices in case other soldering process is used, or in case the soldering is done

under different conditions.

µ PD16716N-××× : TCP (TAB package)

Mounting Condition

Mounting Method

Thermocompression

Soldering

ACF

(Adhesive

Conductive Film)

Condition

Heating tool 300 to 350°C: heating for 2 to 3 seconds: pressure 100g (per

solder)

Temporary bonding 70 to 100°C: pressure 3 to 8 kg/cm2 : time 3 to 5

seconds.

Real bonding 165 to 180°C: pressure 25 to 45 kg/cm2 : time 30 to 40

seconds. (When using the anisotropy conductive film SUMIZAC1003 of

Sumitomo Bakelite, Ltd.)

Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF manufacturing

company. Be sure to avoid using two or more packaging methods at a time.

16

Data Sheet S14417EJ1V1DS

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