STANDARD PRODUCT
DATA SHEET
PMC-1970624
ISSUE 10
PM4351 COMET
COMBINED E1/T1 TRANSCEIVER
18 ORDERING AND THERMAL INFORMATION
Table 123 - Ordering Information
Part No.
PM4351-RI
PM4351-NI
Description
80-Pin Metric Plastic Quad Flat Pack (MQFP)
81-Ball Chip Array Ball Grid Array (CABGA)
Table 124 - Thermal Information
Forced Air (Linear Feet per Minute)
Part No.
Case
Theta J-A
Temperature
Conv 100 200 300 400 500
PM4351-RI -40°C to
85°C
PM4351-NI -40°C to
85°C
Dense Board1 62.1 54.8 49.1 45.0 42.4 41.1
JEDEC Board2 43.2 40.7 39.2 38.5 38.2 38.0
Dense Board3 99.5 92.9 87.8 84.0 81.0 78.5
JEDEC Board4 47.8 45.8 44.4 43.5 43.0 42.7
1. - Dense Board is defined as a 3S3P board and consists of a 3x3 array of
PM4351-RI devices located as close to each other as board design rules allow. All
PM4351-RI devices are assumed to be dissipating 0.416 Watts. Theta J-A listed is
for the device in the middle of the array.
2. - JEDEC Board Theta J-A is the measured value for a single thermal device in the
same package on a 2S2P board following EIA/JESD 51-3.
3. - Dense Board is defined as a 3S3P board and consists of a 3x3 array of
PM4351-NI devices located as close to each other as board design rules allow. All
PM4351-NI devices are assumed to be dissipating 0.416 Watts. Theta J-A listed is
for the device in the middle of the array.
4. - JEDEC Board Theta J-A is the measured value for a single thermal device in the
same package on a 2S2P board following EIA/JESD 51-3.
PROPRIETARY AND CONFIDENTIAL
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