TLP700F Просмотр технического описания (PDF) - Toshiba

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TLP700F

GaAℓAs IRED + Photo IC Photocoupler

Toshiba 

Soldering and Storage

(1) Precautions for Soldering

1) When Using Soldering Reflow

z An example of a temperature profile when Sn-Pb eutectic solder is used:

TLP700

z An example of a temperature profile when lead(Pb)-free solder is used:

z Reflow soldering must be performed once or twice.

z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Apply preheating of 150 deg.C for 60 to 120 seconds.

z Mounting condition of 260 deg.C or less within 10 seconds is recommended.

z Flow soldering must be performed once

3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds

not exceeding 350 deg.C.

z Heating by soldering iron must be only once per 1 lead

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2010-02-23

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