42994E Просмотр технического описания (PDF) - Infineon Technologies

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Компоненты Описание

производитель

42994E

Low Dropout Fixed Voltage Regulator

Infineon Technologies 

TLE42994

General Product Characteristics

4.3

Thermal Resistance

Pos. Parameter

Symbol

Limit Value

Unit Conditions

Min. Typ. Max.

TLE42994G (PG-DSO-8)

4.3.4

4.3.5

4.3.6

Junction to Soldering Point1)

Junction to Ambient1)

RthJSP

–

RthJA

–

–

–

60 K/W measured to pin 5

113 –

K/W

2)

185 –

K/W Footprint only3)

4.3.7

–

142 –

K/W 300mm2 heatsink area on

PCB3)

4.3.8

–

136 –

K/W 600mm2 heatsink area on

PCB3)

TLE42994GM (PG-DSO-14)

4.3.9

4.3.10

4.3.11

Junction to Soldering Point1)

Junction to Ambient1)

RthJSP

–

RthJA

–

–

–

30 K/W measured to all GND pins

63 –

K/W

2)

112 –

K/W Footprint only3)

4.3.12

–

73 –

K/W 300mm2 heatsink area on

PCB3)

4.3.13

–

65 –

K/W 600mm2 heatsink area on

PCB3)

TLE42994E (PG-SSOP-14)

4.3.14

4.3.15

4.3.16

Junction to Case1)

Junction to Ambient1)

RthJC

–

RthJA

–

–

10 –

47 –

140 –

K/W

K/W

K/W

–

2)

Footprint only3)

4.3.17

–

63 –

K/W 300mm2 heatsink area on

PCB3)

4.3.18

–

53 –

K/W 600mm2 heatsink area on

PCB3)

1) not subject to production test, specified by design

2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

3) Specified RthJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product

(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).

Data Sheet

11

Rev. 1.1, 2009-05-19

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