TEA152X Просмотр технического описания (PDF) - NXP Semiconductors.

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производитель

TEA152X

SMPS ICs for low-power systems

NXP Semiconductors. 

NXP Semiconductors

19. Figures

Fig 1.

Fig 2.

Fig 3.

Fig 4.

Fig 5.

Fig 6.

Fig 7.

Fig 8.

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

Pin configuration DIP8 . . . . . . . . . . . . . . . . . . . . . .4

Pin configuration SO14 . . . . . . . . . . . . . . . . . . . . .4

Signals for valley switching . . . . . . . . . . . . . . . . . .6

Typical phase of drain ringing at switch-on

(at N × Vo = 80 V). . . . . . . . . . . . . . . . . . . . . . . . . .7

Primary sensed application; configuration

for TEA152xP (DIP8) . . . . . . . . . . . . . . . . . . . . . .12

Package outline SOT97-1 (DIP8) . . . . . . . . . . . .13

Package outline SOT108-1 (SO14) . . . . . . . . . . .14

TEA152x

SMPS ICs for low-power systems

TEA152X

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 04 — 14 September 2010

continued >>

© NXP B.V. 2010. All rights reserved.

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