TEA152X Просмотр технического описания (PDF) - NXP Semiconductors.

Номер в каталоге

Компоненты Описание

производитель

TEA152X

SMPS ICs for low-power systems

NXP Semiconductors. 

NXP Semiconductors

13. Package outline

DIP8: plastic dual in-line package; 8 leads (300 mil)

TEA152x

SMPS ICs for low-power systems

SOT97-1

D

L

Z

e

b

8

A2 A

A1

wM

b1

b2

5

pin 1 index

E

ME

c

(e 1)

MH

1

4

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

A

max.

A1

A2

min. max.

b

b1

b2

c

D (1)

E (1)

mm

4.2

0.51

3.2

1.73 0.53

1.14 0.38

1.07 0.36

0.89 0.23

9.8

9.2

6.48

6.20

inches 0.17

0.02

0.13

0.068 0.021 0.042 0.014

0.045 0.015 0.035 0.009

0.39

0.36

0.26

0.24

e

2.54

0.1

e1

7.62

0.3

L

3.60

3.05

0.14

0.12

ME

8.25

7.80

0.32

0.31

MH

10.0

8.3

0.39

0.33

w

Z (1)

max.

0.254 1.15

0.01 0.045

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

SOT97-1

IEC

050G01

REFERENCES

JEDEC

JEITA

MO-001

SC-504-8

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-13

Fig 7. Package outline SOT97-1 (DIP8)

TEA152X

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 04 — 14 September 2010

© NXP B.V. 2010. All rights reserved.

13 of 20

Share Link: