TEA6810V Просмотр технического описания (PDF) - Philips Electronics

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TEA6810V

Front-end and PLL synthesizers for car radios

Philips Electronics 

TPS72501

TPS72515, TPS72516

TPS72518, TPS72525

SLVS341D – MAY 2002 – REVISED MARCH 2004

www.ti.com

THERMAL INFORMATION (continued)

To illustrate, the TPS72525 in a DDPAK package was chosen. For this example, the average input voltage is 5

V, the output voltage is 2.5 V, the average output current is 1 A, the ambient temperature 55°C, the air flow is

150 LFM, and the operating environment is the same as documented below. Neglecting the quiescent current,

the maximum average power is:

PDmax + (5 * 2.5) V x 1 A + 2.5 W

(7)

Substituting TJmax for TJ into Equation 6 gives Equation 8:

RθJAmax + (125 * 55)°Cń2.5 W + 28°CńW

(8)

From Figure 21, DDPAK Thermal Resistance vs Copper Heatsink Area, the ground plane needs to be 1 cm2 for

the part to dissipate 2.5 W. The operating environment used in the computer model to construct Figure 21

consisted of a standard JEDEC High-K board (2S2P) with a 1 oz. internal copper plane and ground plane. The

package is soldered to a 2 oz. copper pad. The pad is tied through thermal vias to the 1 oz. ground plane.

Figure 22 shows the side view of the operating environment used in the computer model.

40

No Air Flow

35

150 LFM

30

250 LFM

25

20

15

0.1

1

10

100

Copper Heatsink Area − cm2

Figure 21. DDPAK Thermal Resistance vs Copper Heatsink Area

2 oz. Copper Solder Pad

with 25 Thermal Vias

1 oz. Copper

Power Plane

1 oz. Copper

Ground Plane

Thermal Vias, 0.3 mm

Diameter, 1,5 mm Pitch

Figure 22. DDPAK Thermal Resistance

12

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