Philips Semiconductors
16. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA8942P
2 x 1.5 W stereo BTL audio amplifier
SOT38-1
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055 0.021 0.013
0.045 0.015 0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01 0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT38-1
IEC
050G09
REFERENCES
JEDEC
EIAJ
MO-001
SC-503-16
EUROPEAN
PROJECTION
ISSUE DATE
95-01-19
99-12-27
Fig 16. DIP16 package outline.
9397 750 06862
Product specification
Rev. 02 — 14 March 2000
© Philips Electronics N.V. 2000. All rights reserved.
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