Philips Semiconductors
8 W BTL or 2 × 4 W SE power amplifier
Product specification
TDA1517ATW
PACKAGE OUTLINE
HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm
SOT527-1
D
c
y
heathsink side
Z
Dh
20
11
E
A
X
HE
vM A
Eh
pin 1 index
1
e
10
wM
bp
A2
A1
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) Dh E(2) Eh
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.20
0.09
6.6
6.4
4.3
4.1
4.5
4.3
3.1
2.9
0.65
6.6
6.2
1.0
0.75
0.50
0.2
0.13
0.1
0.5
0.2
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT527-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-11-12
00-07-12
2001 Apr 17
14