ST7576 Просмотр технического описания (PDF) - Sitronix Technology Co., Ltd.
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ST7576 Datasheet PDF : 54 Pages
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ST7576
3. ST7576 Pad Arrangement
Chip Size: 5570 um ×770 um
Bump Height: 15 um
Chip Thickness: 480 um
Bump Pitch: (minimum)
PAD Number
Pitch
PAD Number
1~27, 130~156, 157~163, 243~250:
37.20 212~213
28~129:
33.00 213~216,218~221
27~28
62.90 216~217,217~218
129~130
60.69 221~222
163~164
329.57 228~229
164~207, 208~211,222~228,229~235,236~242
59.30 235~236
207~208
131.83 242~243
211~212
71.30
* Refer to “Pad Center Coordinates” section for ITO layout.
Unit: um
Pitch
46.65
33.30
38.80
46.30
66.40
62.45
79.90
Ver 1.0
Fig 1
2/54
2007/01/29
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