CXA3329ER Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXA3329ER

Analog Signal Processor TX-IF IC for W-CDMA Cellular Phones

Sony Semiconductor 

Package Outline

Unit: mm

24PIN VQFN(PLASTIC)

4.0

3.6

C

18

13

0.9 ± 0.1

0.7

0.05 S

A 19

12 B

PIN 1 INDEX

24

7

1

6

0.4

x4

S

0.1 S A-B C

x4

0.1 S A-B C

0.05 M S A-B C

0.6 ± 0.1

45˚

1.0

CXA3329ER

SONY CODE

EIAJ CODE

JEDEC CODE

VQFN-24P-03

Solder Plating

0.13 ± 0.025

+ 0.09

0.14 – 0.03

TERMINAL SECTION

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.04g

– 14 –

Sony Corporation

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