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SM802149UMG Просмотр технического описания (PDF) - Micrel

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SM802149UMG Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Micrel, Inc.
SM802149
Absolute Maximum Ratings(2)
Supply Voltage (VDD, VDDOX)........................................+4.6V
Input Voltage (VIN) .................................. 0.5V to VDD+0.5V
Lead Temperature (soldering, 20s)............................ 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts)......................... 65°C to +150°C
Operating Ratings(3)
Supply Voltage (VDD, VDDOX) ................. +2.375V to +3.465V
Ambient Temperature (TA) .......................... –40°C to +85°C
Junction Thermal Resistance(4)
QFN (θJA)
Still-Air ......................................................... 24°C/W
QFN (ψJB)
Junction to Board .......................................... 8°C/W
DC Electrical Characteristics(5)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%, VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%, TA = 40°C to +85°C.
Symbol
Parameter
Condition
Min. Typ.
VDD, VDDO1/2
3.3V Operating Voltage
2.5V Operating Voltage
VDDO1 = VDDO2
3.135 3.3
VDDO1 = VDDO2
2.375 2.5
Outputs loaded 156.25MHz
181
Outputs loaded 312.5MHz
216
Max.
3.465
2.625
235
280
Units
V
V
mA
LVCMOS Input (OE1, OE2, PLL_BYPASS) DC Electrical Characteristics(5)
VDD = 3.3V ±5%, or 2.5V ±5%, TA = 40°C to +85°C.
Symbol Parameter
Condition
Min.
Typ.
Max.
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
IIL
Input Low Current
VDD = VIN = 3.465V
VDD = 3.465V, VIN = 0V
2
0.3
150
VDD + 0.3
0.8
150
Units
V
V
µA
µA
REF_IN DC Electrical Characteristics(5)
VDD = 3.3V ±5%, or 2.5V ±5%, TA = 40°C to +85°C.
Symbol Parameter
Condition
Min.
Typ.
Max.
Units
VIH
Input High Voltage
VIL
Input Low Voltage
1.1
0.3
VDD + 0.3
V
0.6
V
IIN
Input Current
VIN = 0V to VDD
5
5
µA
Notes:
2. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this datasheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
3. The datasheet limits are not guaranteed if the device is operated beyond the operating ratings.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.
5. The circuit is designed to meet the AC and DC specifications shown in the above tables after thermal equilibrium has been established.
March 1, 2013
5
Revision 1.1
hbwhelp@micrel.com or (408) 955-1690

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