SIP32462(2013) Просмотр технического описания (PDF) - Vishay Semiconductors
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производитель
SIP32462 Datasheet PDF : 16 Pages
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www.vishay.com
Package Information
Vishay Siliconix
WCSP4: 4 Bumps
(2 x 2 , 0.4 mm pitch, 208 μm bump height, 0.8 mm x 0.8 mm die size)
Mark on backside of die
Pin 1 mark
1
2
2
A
W
B AB
4xØb
1
A
B
e
D
Notes
(1) Laser mark on the backside surface of die
(2) Bumps are SAC396
(3) 0.050 max. coplanarity
MILLIMETERSa
DIM.
A
A1
b
e
D
MIN.
0.515
0.250
0.720
NOM.
0.530
0.208
0.260
0.400
0.760
Note
a. Use millimeters as the primary measurement.
ECN: T11-0497-Rev. B, 10-Oct-11
DWG: 6004
MAX.
0.545
0.270
0.800
Bump Note 2
MIN.
0.0202
0.0098
0.0182
INCHES
NOM.
0.0208
0.0081
0.0102
0.0157
0.0193
MAX.
0.0214
0.0106
0.0203
Revision: 10-Oct-11
1
Document Number: 63459
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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